A computational framework to model the lifecycle of a breakthrough neurovascular implant: crimping into catheter and deployment mechanisms
Percutaneous treatment of cerebral aneurysms (CAs) has recently gained the attention of researchers and practitioners. The advent of the eCLIPs implant (product of Evasc Neurovascular Enterprises, Vancouver, Canada) has revolutionized the percutaneous treatment of CAs by offering innovative solutions to the challenges pertinent to other neurovascular devices, i.e. excessive vessel injury caused by device and artery interaction and blocking the daughter vessels in bifurcation cases –. However, in a subset of bifurcation CAs with fusiform pathology, eCLIPs fails to provide sufficient neck bridging, where a gap exists between the device structure and the aneurysm/artery wall upon device deployment. We have developed a new design for the eCLIPs (VR-e) by making the length of device ribs variable to cover such an inflow gap . In this study, we have developed a new finite element model to evaluate the device behavior during crimping into a catheter and its expansion at the aneurysm neck, which is not possible by testing a new device for the endovascular application experimentally.